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PWS-E (Electroplated type) PWS-R (Resin bond type)
2 to 10 times higher efficient sawing compared to loose abrasive method
Improvement of working conditions due to use of water soluble cutting fluid
Improvement of environment due to separate collection of chip from wastes
Various specifications available
Cutting of glass, ceramics, quartz, sapphire and other brittle materials
Cutting of silicon ingots for semiconductor devices and solar cells
Cutting of magnetic materials such as neodymium and ferrite magnets
Cutting of various ingots, SiC and substrates