| GLP-200W |
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Grinder for Superhard Materials
Grinding machine which capable to grind wafer of resistant materials(SiC,LT,GaN,AL2O3)which high speed ,high accuracy |
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Support Non-Contact grinding. Best function for grinding the laminated thin wafer etc |
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High rigidity configuration |
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Working time is shortened remarkably by the structure considering the improvement of work efficiency. |
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Selectable 3 process mode |
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Dramatic improvement on TTV |
| ※Non-contact grinding is an option |
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